One-piece suspension assembly including interconnect

ABSTRACT

An integrated suspension assembly including interconnect is used to provide an electrical and mechanical connection between an actuation system and a slider. The suspension assembly includes a multi-layer laminate substrate having a base layer, an insulator layer and a conductor layer. The laminate substrate further includes an attachment region for attaching the suspension assembly to an actuator arm, a load beam region, a flexure region for supporting the slider, and an interconnect path. The interconnect path extends along the flexure region, the load beam region and the attachment region wherein the path terminates at the attachment region at a connection point to provide an electromechanical attachment to the actuator arm.

CROSS-REFERENCE TO RELATED APPLICATION(S)

[0001] This application claims priority from provisional application No.60/475,053 filed Jun. 2, 2003, for “One-Piece Low Cost FlexureInterconnect and Attachment” by Andrew J. Hutchinson, Bradley J. VerMeer and Zine-Eddine Boutaghou.

BACKGROUND OF THE INVENTION

[0002] The present invention relates to a low cost suspension assembly.In particular, the present invention relates to a one-piece integratedsuspension assembly to provide mechanical and electrical connectionbetween an actuator arm and a slider supporting a read/write head for adisc drive actuation assembly.

[0003] Generally, a magnetic disc drive includes a magnetic disc and amagnetic read/write head. When the disc rotates, the read/write headreads and writes magnetic signals on circular tracks of the disc. Theread/write head is typically mounted on a slider, which is supported bya flexure or head gimbal assembly. The flexure is mounted to asuspension or load beam, which biases the slider toward the surface ofthe rotating disc. This biasing is sometimes referred to as“pre-loading”. The load beam is attached to an actuator arm of anactuator at an attachment plate, or base plate. The actuator arm movesthe read/write head over the spinning disc during operation.

[0004] A typical prior art suspension assembly is comprised of fourcomponents, an attachment plate, a load beam, a flexure and aninterconnect, including a flex circuit material and metal trace. One endof the load beam is attached to the actuator arm at the attachmentplace, oftentimes by swaging. A flexure is attached to an opposite endof the load beam, oftentimes with an adhesive and/or welding, and theslider is mounted to a bottom surface of the flexure. The interconnectis attached to bottom surfaces of the flexure, the load beam and theattachment plate to form an electrical connection path from the sliderto the actuator arm. First, a flex circuit material is deposited uponthe bottom surface of the suspension assembly, either the entire surfaceor a portion defining the interconnect path. Second, a metal trace isdeposited upon the flex circuit material to provide the electricalconnection between the slider and the actuator arm. The flex circuitmaterial insulates the metal trace from the suspension assembly.Alternatively, a pre-fabricated interconnect is attached to the bottomsurfaces of the suspension assembly.

[0005] Other prior art suspension assemblies include integratedcomponents to improve performance by decreasing the number of suspensioncomponents, however, none include a low cost, one-piece, or singlecomponent, suspension assembly. For example, some suspension assembliesinclude an integrated load beam and flexure, an integrated flexure andinterconnect, an integrated load beam, flexure and interconnect, or anintegrated attachment plate, load beam and flexure. These suspensionassemblies require extra assembly processes to complete the suspensionassembly prior to attaching the assembly to the actuator arm or mountingthe slider. Examples of extra assembly processes include, attaching theattachment plate to the load beam for connection to the actuator arm,attaching the load beam to the flexure and/or attaching the interconnectto the suspension assembly.

[0006] As the disc drive industry advances technologically, each elementof the disc drive assembly is becoming increasingly integrated, andspace and assembly costs are at a premium. It is desirable to integratethe components of the suspension assembly into a single piece to providemechanical and electrical connections between the slider and theactuator arm and a simpler, less expensive suspension assembly.

BRIEF SUMMARY OF THE INVENTION

[0007] The present invention relates to a low-cost, integratedsuspension assembly, including interconnect, to provide an electricaland mechanical connection between an actuation system and a slider. Thesuspension assembly includes a multi-layer laminate substrate having abase layer, an insulator layer and a conductor layer. The laminatesubstrate further includes an attachment region for attaching thesuspension assembly to an actuator arm, a load beam region, a flexureregion for supporting the slider, and an interconnect path. Theinterconnect path extends along the flexure region, the load beam regionand the attachment region wherein the path terminates at the attachmentregion at a connection point to provide an electromechanical attachmentto the actuator arm.

BRIEF DESCRIPTION OF THE DRAWINGS

[0008]FIG. 1 is a perspective view of a prior art disc drive actuationsystem for positioning a slider over tracks of a disc.

[0009]FIG. 2A is a top perspective view of one embodiment of anintegrated suspension assembly of the present invention.

[0010]FIG. 2B is a bottom perspective view of the suspension assemblyshown in FIG. 2A.

[0011]FIG. 3 is a cross-sectional view of a multi-layer laminatesubstrate.

[0012]FIG. 4A is a top perspective view of another embodiment of anintegrated suspension assembly of the present invention.

[0013]FIG. 4B is a bottom perspective view of the suspension assemblyshown in FIG. 4A.

[0014]FIG. 5 is a top perspective view of another embodiment of anintegrated suspension assembly of the present invention.

[0015]FIG. 6 is a bottom perspective view of the suspension assembly ofthe present invention with one embodiment of integrated interconnectpads.

[0016]FIG. 7 is a bottom perspective view of the suspension assembly ofthe present invention with a further embodiment of integratedinterconnect pads.

[0017]FIG. 8 is a bottom perspective view of the suspension assembly ofthe present invention with integrated stiffener plates.

DETAILED DESCRIPTION

[0018]FIG. 1 is a perspective view of a prior art disc drive actuationsystem 10. Actuation system 10 includes a voice coil motor (VCM) 12arranged to rotate an actuator arm 14 on a spindle around an axis 16. Aload beam 18 is connected to actuator arm 14 at an attachment plate 20,or base plate. A flexure 22 is connected to an end of load beam 18, andcarries a slider 24. Slider 24 carries a transducing head (not shown)for reading and/or writing data on a disc 26, which rotates around anaxis 28 and includes concentric tracks 30 on which the data is written.VCM 12 is selectively operated to move actuator arm 14 around axis 16,thereby moving slider 24 between tracks 30 of disc 26. As disc 26rotates, windage is encountered by slider 24 to keep it aloft a smalldistance above the surface of disc 26.

[0019] The present invention is a low cost suspension assembly. Inparticular, the present invention relates to a one-piece integratedsuspension assembly that provides mechanical and electrical connectionsbetween actuator arm 18 and slider 24 supporting a read/write head (notshown) for disc drive actuation system 10. The suspension assembly canbe incorporated into any actuation system that requires a flexibleinterconnect between the actuation system and another, for example, adisc drive actuation system or a microscope. The suspension assemblyincorporates attachment plate 20, load beam 18 and flexure 22 into asingle component, and also includes an integrated interconnect path, toprovide a simple, low cost suspension assembly.

[0020]FIG. 2A is a top perspective view of an integrated, one-piecesuspension assembly 32 of the present invention, and FIG. 2B is a bottomperspective view of suspension assembly 32. Suspension assembly 32 isformed from a multi-layer laminate substrate 34, shown in FIG. 3.

[0021]FIG. 3 is a cross-sectional view of multi-layer laminate substrate34. Laminate substrate 34 includes a support layer 36, or base layer, aninsulator layer 38 and a conductor layer 40. Support layer 36 iscomposed of a non-corrosive material, such as stainless steel. Insulatorlayer 38 is composed of a dielectric material, such as polyimide, andconductor layer 40 is composed of an electrically conductive material,such as copper, aluminum or the like. One example of laminate substrate34 is TSA™ manufactured by Rogers Corp. (of Rogers, Conn.). In furtherembodiments of suspension assembly 32, fewer or more layers may be usedto form laminate structure 34.

[0022] As shown in FIGS. 2A and 2B, suspension assembly 32 includes anattachment region 42, a load beam region 44, a flexure region 46, and aninterconnect path 48, which as an integrated assembly formed by singlecomponent suspension assembly 32 fabricated from substrate 34.Suspension assembly 32 has a first end 50 and a second end 52.Attachment region 42 is located at first end 50 of suspension assembly32 and attaches suspension assembly 32 to actuator arm 14. Flexureregion 46 is located at second end 52 of suspension assembly 32 andsupports slider 24. Load beam region 44 is a flexible region positionedbetween attachment region 42 and flexure region 46.

[0023] Suspension assembly 32 includes a top surface 54 formed bysupport layer 36 of laminate substrate 34 and an opposite bottom surface56 formed by a combination of support layer 36, insulator layer 38, andconductor layer 40. Interconnect path 48 extends along bottom surface 56of suspension assembly 32 from flexure region 46, across load beamregion 44, to attachment region 42. Interconnect path 48 is defined byinsulator layer 38 and conductor layer 40 of laminate substrate 34,wherein insulator layer 38 defines the flex circuit material ofinterconnect path 48 and conductor layer 40 forms a metal trace ofinterconnect path 48. Insulator layer 38 insulates the metal conductorlayer 40 from support layer 36.

[0024] Slider 24 is supported upon bottom surface 56 of flexure region46 of suspension assembly 32. A first end 58 of interconnect path 48 isinterconnected with slider 24 to provide an electrical connection fromslider 24 to actuator arm 14 (not shown). A second end 60 ofinterconnect path 48 terminates at a connection point 62, defined byconductor layer 40, at attachment region 42. Bottom surface 56 ofattachment region 42 of the suspension assembly 32 is attached toactuator arm 14. Connection point 62 provides an electrical andmechanical attachment to actuator arm 14. To connect suspension assembly32 to actuator arm 14, a solder and/or conductive adhesive connection ismade between connection point 62 and the actuator arm. In addition, anon-conductive adhesive may also be used to further bond attachmentregion 42 of suspension assembly 32 to actuator arm 14.

[0025] Attachment region 42 has a forward portion 64 which is adjacent arearward portion 66 of load beam region 44. In attaching suspensionassembly 32 to actuator arm 14, forward portion 64 of attachment region42 is attached to actuator arm 14 with either solder or asolder/adhesive combination. Attaching forward portion 64 of attachmentregion 42 insures a good attachment to actuator arm 14 and constrainsattachment region 42 to further provide mechanical stiffness andperformance to suspension assembly 32. That is, constraining attachmentregion 42 at an attachment line 68 further defines the stiff andflexible portion of suspension assembly 32.

[0026] Load beam region 44 of suspension assembly 32 includes a void 70positioned at rearward portion 66. Removing a portion of support layer36 proximate attachment line 68 and at rearward portion 66 of load beamregion 44, adjusts vertical stiffness of suspension assembly 32 toprovide more or less vertical stiffness and adjusts the performance ofsuspension assembly 32. Removing support layer 36 directly under whereinterconnect path 48 crosses from load beam region 44 to attachmentregion 42, increases flexibility of load beam region 44 and flexureregion 46 is provided.

[0027] As seen in FIGS. 2A and 2B, attachment region 42 of suspensionassembly 32 includes a void 72. Void 72 facilitates the positioning andlocation of suspension assembly 32 with respect to the actuator arm. Forexample, a pin is driven through void 72 to locate the actuator arm withrespect to suspension assembly 32 and to make them coincident. Once thesuspension assembly 32 and the actuator arm are aligned, the attachmentis made with either solder or a solder/adhesive combination to attachthe two pieces. In further embodiments of the present invention, void 72maybe adapted to provide a connection between suspension assembly 32 andthe actuator arm.

[0028] Two examples of fabricating the one-piece suspension assembly 32are an etching process and a deposition process. In the first example,multi-layer laminate substrate 34 is etched to form suspension assembly32. Selected portions of support layer 36, insulator layer 38, andconductor layer 40 are etched away to form suspension assembly 32. Inanother example, insulator layer 38 and conductor layer 40 are depositedupon selected portions of support layer 36 to define interconnect path48 and connection point 62, and thereby form the one-piece suspensionassembly 32. In further embodiments of suspension assembly 32, otheradditive or subtractive process maybe used to fabricate substrate 34 andsuspension assembly 32.

[0029]FIGS. 4A and 4B are top and bottom perspective views,respectively, of an alternate embodiment of integrated suspensionassembly 32. Suspension assembly 32 includes a first rail 74 and asecond rail 76 for improved tracking performance. No additional assemblyprocesses are required, beyond forming rails 74 and 76, to preparesuspension assembly 32 for attachment to actuator arm 14 (not shown).First and second rails 74, 76 are defined by support layer 36.Suspension assembly 32 includes first and second edges 78 and 80, whichextend between first end 50 and second end 52. Adjacent load beam region44 of suspension assembly 32, first edge 78 is folded upward from thetop surface to form first rail 74 and second edge 80 is folded upwardfrom top surface 54 to form second rail 76. Thus, first and second rails74 and 76 extend substantially perpendicular from top surface 54 ofsuspension assembly 32.

[0030] In further embodiments of the present invention, first and secondrails 74, 76 are positioned along attachment region 42 and/or flexureregion 46, instead of or in addition to rails positioned along load beamregion 44. In addition, fewer or more rails may be formed by supportlayer 36 or a rail may be formed by support layer 36 anywhere onsuspension assembly 32, not just along edges 78, 80.

[0031] Rails 74 and 76 formed along suspension assembly 32 increase thestiffness, or structural rigidity, of the suspension assembly to therebyenhance performance with respect to the embodiment shown in FIGS. 2A and2B. Increased structural rigidity results in an increased vibrationalfrequency mode, which places the bending and twisting modes of theassembly at a higher frequency. A higher vibrational frequency moderesults in improved tracking performance when positioning slider 24 withrespect to tracks 30 of disc 26. One reason for increasing the stiffnessof the flexure region 46 of suspension assembly 32 is to permit aload/unload application of suspension assembly 32, for example, byintegrating a tab formed from support layer 36 at flexure region 46.

[0032] Suspension assembly 32 includes integrated interconnect path 82,which extends from flexure region 46, along load beam region 44, toattachment region 42. Interconnect path 82 is defined by insulator layer38 and conductor layer 40. A first end 84 of interconnect path 82 iselectrically connected to slider 24 via ball bonds 86. A second end 87of interconnect path 48 terminates at forward portion 64 of attachmentregion 42, adjacent load beam region 44, to form a connection pointbetween suspension assembly 32 and actuator arm 14 (not shown).Interconnect pads 88, defined by conductor layer 40, are formed atattachment region 42 to provide electrical and mechanical connection ofsuspension assembly 32 to actuator arm 14. Solder and/or conductiveadhesive is used to electrically and mechanically connect interconnectpads 88 to actuator arm 14. In addition, a non-conductive adhesive atattachment region 42 may also be used to attach suspension assembly 32to actuator arm 14.

[0033]FIG. 5 is a top perspective view of another embodiment ofintegrated suspension assembly 32, including a thicker, partially etchedportion to enhance performance of suspension assembly 32. Partialetching of support layer 36 during fabrication of suspension assembly 32is used to vary a thickness of a portion of suspension assembly 32 alonga length of suspension assembly 32. In the embodiment shown in FIG. 5,load beam region 44 has a thickness greater than a thickness ofattachment region 42 and a thickness of flexure region 46. In furtherembodiments either attachment region 42, flexure region 46 or both mayhave an increased thickness (with respect to the embodiment shown inFIGS. 2A and 2B) instead of or in addition to load beam region 44.

[0034] In the suspension assembly shown in FIG. 5, a multi-layerlaminate substrate with a support layer having a greater thickness thana standard laminate substrate (for example, laminate substrate 34 shownin FIG. 3) is used. Portions of the substrate are not etched as deeply,i.e., partially etched, as a remainder of the substrate to achieve thevarying thickness of suspension assembly 32. Increasing the thickness ofa portion of suspension assembly 32 increases the structural rigidityand vibrational frequency mode to thereby enhance performance ofsuspension assembly 32 (with respect to the embodiment shown in FIGS. 2Aand 2B). Increasing the thickness of the attachment region 42 ofsuspension assembly 32 provides additional structure to form anattachment between suspension assembly 32 and actuator arm 14.Increasing the stiffness of the flexure region 46 of suspension assembly32 permits a load/unload application of suspension assembly 32, forexample, by integrating a tab formed from support layer 36 at flexureregion 46.

[0035]FIG. 6 is a bottom perspective view of suspension assembly 32illustrating another embodiment of an integrated interconnect path 90.Interconnect path 90 extends from flexure region 46, along load beamregion 44, to attachment region 42 of suspension assembly 32. A firstend 92 of interconnect path 90 is electrically interconnected withslider 24 via various methods, including gold ball bonds or solder 86. Asecond end 93 of interconnect path 90 terminates at attachment region 42of suspension assembly 32, to form a connection point between suspensionassembly 32 and actuator arm 14 (not shown). Interconnect pads 94 arepositioned at a rearward portion 96 of attachment region 42, adjacentfirst end 50 of suspension assembly 32, to provide an electrical andmechanical connection between suspension assembly 32 and actuator arm14. Interconnect path 90 is defined by insulator layer 38 and conductorlayer 40 and interconnect pads 94 are defined by conductor layer 40.Solder and/or conductive adhesive electrically and mechanically connectsinterconnect pads 94 of suspension assembly 32 to actuator arm 14. Inaddition, a non-conductive adhesive at attachment region 42 may also beused to attach the two pieces and constrain attachment region 42 atattachment line 68.

[0036]FIG. 7 is a bottom perspective view of suspension assembly 32illustrating another embodiment of an integrated interconnect path 98.Interconnect path 98 extends from flexure region 46, along load beamregion 44, to attachment region 42. Interconnect path 98 includes twosections of interconnect pads. A first section of interconnect pads 100are located at forward portion 64 of attachment region 42 and proximateload beam region 44. A second section of interconnect pads 102 arelocated at attachment region 42 and adjacent first end 50 of suspensionassembly 32. Interconnect path 98 connects the two sections of pads 100,102 to maintain the electrical path. First section of pads 100 andsecond section of pads 102 provide an electrical and mechanicalconnection between suspension assembly 32 and actuator arm 14 (notshown). Solder and/or conductive adhesive connects interconnect pads 100and 102 with actuator arm 14. In addition, a non-conductive adhesive atattachment region 42 may also be used to further bond the two pieces andconstrain attachment region 42 at attachment line 68.

[0037] In each embodiment discussed above, each interconnect pad sectionincludes four pads, however, in further embodiments of the presentinvention fewer or more interconnect pads are located at each section.Interconnect pads are located at attachment region 42 of suspensionassembly 32 and are positioned at any location on bottom surface 56 ofattachment region 42 to provide an electro-mechanical attachment betweensuspension assembly 32 and actuator arm 14. In addition to theinterconnect pad locations discussed above, forward interconnect (FIG.4B), rearward interconnect (FIG. 6), and four-corner interconnect (FIG.7), other examples include interconnect pads located along edges 78 and80 or centered at attachment region 42.

[0038]FIG. 8 is a bottom perspective view of integrated suspensionassembly 32, including integrated stiffener plates 104 and 106, orstiffener members, to add structural rigidity to suspension assembly 32.First and second stiffener plates 104, 106 are positioned at load beamregion 44 of suspension assembly 32. Stiffener plates 104, 106 aredefined by conductor layer 40 of laminate substrate 34 and do notelectrically connect with interconnect path 48. In further embodimentsof the present invention, fewer or more stiffener plates are fabricatedas part of integrated suspension assembly 32 and may be located at anyregion 42, 44, 46 along bottom surface 56 of suspension assembly 32.Stiffener plates 104, 106 provide additional stiffness to suspensionassembly 32, which increases the vibrational frequency mode and enhancesperformance of suspension assembly 32. In addition, an electricallyisolated stiffener plate integrated at attachment region 42 provides anadditional area for mechanical attachment between suspension assembly 32and actuator arm 14.

[0039] The present invention is a simple, low cost suspension assemblyincluding an interconnect path. The suspension assembly is a singlecomponent, with an integrated attachment plate, load beam, flexure, andinterconnect path. The integrated suspension assembly is fabricated froma multi-layer laminate substrate having a support layer, an insulatorlayer and a conductor layer. Fabricating the entire integratedsuspension assembly from the laminate substrate is a cost effectivemethod for building the assembly that requires no additional assemblyprocesses for completing the suspension assembly prior to attachment toan actuation assembly or mounting another component, such as a slider.

[0040] Although the present invention has been described with referenceto preferred embodiments, workers skilled in the art will recognize thatchanges may be made in form and detail without departing from the spiritand scope of the invention.

1. A suspension assembly comprising: a slider supporting a read/writehead; and a multi-layer laminate substrate having a base layer, aninsulator layer and a conductor layer, the laminate substrate furthercomprising an attachment region for attaching to an actuator arm, a loadbeam region, a flexure region for supporting the slider, and aninterconnect path extending along the flexure region, the load beamregion and the attachment region wherein the interconnect pathterminates at the attachment region at a connection point to provide anelectro-mechanical attachment to the actuator arm.
 2. The suspensionassembly of claim 1 wherein the base layer defines a top surface of thesuspension assembly and the conductor layer defines a bottom surface ofthe suspension assembly.
 3. The suspension assembly of claim 2 wherein arail defined by at least the base layer extends from the top surface ofthe suspension assembly.
 4. The suspension assembly of claim 1 wherein aportion of the base layer has a thickness greater than a remainder ofthe base layer.
 5. The suspension assembly of claim 1 wherein theinterconnect path is defined by the insulator layer and the conductorlayer, and further wherein the connection point is defined by theconductor layer.
 6. The suspension assembly of claim 1, and furthercomprising a stiffener member defined by the conductor layer wherein thestiffener member is not electrically connected to the interconnect path.7. The suspension assembly of claim 6 wherein the stiffener member ispositioned along the load beam region.
 8. The suspension assembly ofclaim 6 wherein the stiffener member is positioned along the attachmentregion to provide a mechanical connection to the actuator arm.
 9. Thesuspension assembly of claim 1, and further comprising a solderconnection between the connection point and the actuator arm.
 10. Thesuspension assembly of claim 1, and further comprising a conductiveadhesive for attaching the attachment region to the actuator arm. 11.The suspension assembly of claim 1, and further comprising anon-conductive adhesive for attaching the attachment region to theactuator arm.
 12. A suspension assembly comprising: a multi-layerlaminate substrate, the laminate substrate having a first end and asecond end, and the laminate substrate having an attachment region atthe first end for attaching to an actuation assembly, a support regionat the second end for supporting an item, a flexible region between theattachment region and the support region, and an interconnect pathextending along a bottom surface of the laminate substrate from thesupport region to the attachment region.
 13. The suspension assembly ofclaim 12 wherein the multi-layer laminate substrate comprises a baselayer forming a top surface of the laminate substrate, a conductor layerforming the bottom surface of the laminate substrate and an insulatorlayer sandwiched between the base layer and the conductor layer.
 14. Thesuspension assembly of claim 13 wherein the interconnect path is definedby the insulator layer and the conductor layer.
 15. The suspensionassembly of claim 13, and further comprising a stiffener plate definedby the conductor layer wherein the stiffener plate is not electricallyconnected to the interconnect path.
 16. The suspension assembly of claim13, and further comprising a rail defined by at least the base layerextending from the top surface.
 17. The suspension assembly of claim 16wherein the multi-layer laminate substrate includes first and secondedges extending between the first end and the second end, the railcomprising a first rail formed by a portion of the first edge and thelaminate substrate further comprising a second rail formed by a portionof the second edge.
 18. The suspension assembly of claim 13 wherein aportion of the base layer has a thickness greater than a remainder ofthe base layer.
 19. The suspension actuation assembly of claim 12wherein the interconnect path further comprises an interconnect padlocated at the attachment region for electro-mechanical connection tothe actuation assembly.
 20. The suspension assembly of claim 19 whereinthe interconnect pad is positioned adjacent the first end of themulti-layer laminate substrate.
 21. The suspension assembly of claim 19wherein the interconnect pad is positioned proximate the flexibleregion.
 22. The suspension assembly of claim 21 wherein the interconnectpad is a first interconnect pad, and further comprising a secondinterconnect pad positioned adjacent the first end of the multi-layerlaminate substrate wherein the interconnect path electrically connectsthe first and second interconnect pads.
 23. An assembly for mechanicallyand electrically linking an actuator arm with a slider supporting aread/write head proximate a rotating disc, the assembly comprising: amulti-layer substrate having an attachment region for attachment to anactuator arm, a load beam region, a flexure region for supporting aslider and an interconnect path, the multi-layer substrate including afirst end at the attachment region and a second end at the flexureregion with the load beam region positioned therebetween; wherein themulti-layer substrate has a support layer defining a top surface of thesubstrate, an insulator layer and a conductor layer defining a bottomsurface of the substrate, the interconnect path being defined by theinsulator layer and the conductor layer; and wherein the interconnectpath terminates at the attachment region at a connection point toprovide an electromechanical attachment to the actuator arm.
 24. Theassembly of claim 23, and further comprising a stiffener plate definedby the conductor layer.
 25. The assembly of claim 23 wherein themulti-layer substrate further comprises a rail formed by a portion ofthe support layer and extending from the top surface of the substrate.26. The assembly of claim 23 wherein a portion of the support layer hasa thickness greater than a remainder of the support layer.
 27. Theassembly of claim 23 wherein the interconnect path further comprises aninterconnect pad at the attachment region for electromechanicalattachment to the actuator arm.
 28. The assembly of claim 23 wherein thesubstrate further comprises a void formed in the load beam regionadjacent the attachment region.
 29. A data storage device comprising: astorage medium; a slider; a read/write head supported by the slider forreading and writing data to and from the storage medium; an actuatorarm; and an integrated suspension assembly including an attachmentregion for attaching to the actuator arm, a load beam region, flexureregion for supporting the slider, and an interconnect path extendingalong the flexure region, the load beam region and the attachment regionto electrically connect the slider to the actuator arm, theintegrated-suspension assembly further comprises a multi-layer laminatesubstrate having a support layer, an insulator layer and a conductorlayer wherein the interconnect path is defined by the insulator layerand the conductor layer.